Poly-supported copper foil

A method for manufacturing a printed circuit board (PCB), the method comprising:

• constructing a first book comprising:
• a first supported copper foil, the first supported copper foil comprising a poly-based film, a thin copper foil, and an adhesive provided between the poly-based film and the thin copper foil, the adhesive being permanently attached to the poly-based film and removably attached to the copper foil;
• a first prepreg adjacent the thin copper foil of the first supported copper foil;
• one or more copper clad laminates adjacent the first prepreg;
• a second prepreg on a side of the one or more copper clad laminates that opposes a side adjacent the first prepreg;
• and
• a second supported copper foil, the second supported copper foil comprising a poly-based film, thin foil copper and an adhesive provided between the poly-based film and the thin copper foil, the adhesive being permanently attached to the poly-based film and removably attached to the copper foil, wherein the second prepreg is adjacent the thin copper foil,
• applying a lamination cycle to the first book using a laminating press to cure the first prepreg and second prepreg;
• and
• after the lamination cycle, removing the poly-based film from the thin copper foil associated with the first supported copper foil and the poly-based film from the thin copper foil associated with the second supported copper foil.