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US 2019/0314950 A1Published application
Polishing apparatus
AssigneeDisco Corporation
InventorsYuki INOUE, Takamasa SUZUKI
Life of this patent
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Abstract
A polishing apparatus includes a holding table having a holding surface that holds a wafer, a polishing unit in which a polishing pad having an opening at the center of a polishing surface that polishes the wafer is mounted to a spindle and is rotated, a slurry supply unit that supplies slurry to the polishing surface of the polishing pad, and an air supply unit that shuts an upper end of a penetrating path penetrating through the axial center of rotation of the polishing pad and the spindle and supplies air into the penetrating path.
Claims3
A polishing apparatus comprising:
- a holding table having a holding surface that holds a wafer;
- a polishing unit in which a polishing pad having an opening at a center of a polishing surface that polishes the wafer held by the holding table is mounted to a spindle and is rotated;
- a slurry supply unit that supplies slurry to the polishing surface of the polishing pad;
- and
- an air supply unit that shuts an upper end of a penetrating path penetrating through an axial center of rotation of the polishing pad and the spindle and supplies air into the penetrating path, wherein
- the air supplied by the air supply unit is sprayed onto an upper surface of the wafer that closes the opening of the polishing pad through bringing the upper surface of the wafer held by the holding table into contact with the polishing surface of the polishing pad, and the wafer is polished in such a manner that the slurry supplied from the slurry supply unit is spread over a whole of the polishing surface due to a flow of the air in a radial manner from the opening toward an outer circumference in a polishing surface direction of the polishing pad.
3 more elements
Dependencies are inferred from the claim text.