Reduced sugar wafer
AssigneeNestec S.A.
InventorsCharles-Austin Sunderland, John Green, Louis De Labauve DArifat
Life of this patent
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Abstract
The present invention relates a sugar reduced wafer composition comprising, 60-80 wt. % of flour, 10-23 wt. % of sucrose, 0.5-8.0 wt. %, preferably 0.5-5 wt. % of oil or fat and 5-20 wt. % of non-digestible fibers wherein the total amount of mono and disaccharides is 10-25 wt. %; all wt. % being in weight percentage of the composition dry mass. The invention also relates to a baked sugar reduced wafer such as a wafer cone or edible container made with this composition and a process for manufacturing the sugar reduced wafer.
Claims15
A sugar reduced wafer composition comprising:
- 60-80 wt. % of flour;
- 10-23 wt. % of sucrose;
- 0.5-8.0 wt. % of oil or fat;
- and
- 5-20 wt. % of non-digestible fibers;
- and
- wherein the total amount of mono and disaccharides is 10-25 wt. % all wt. % being in weight percentage of the composition dry mass.
A baked wafer comprising a sugar reduced wafer composition comprising 60-80 wt. % of flour, 10-23 wt. % of sucrose, 0.5-8.0 wt. % of oil or fat, 5-20 wt. % of non-digestible fibers, and wherein the total amount of mono and disaccharides is 10-25 wt. %, all wt. % being in weight percentage of the composition dry mass and having a water content after baking of 1.0-6.5 wt. % and a water content after storage 2.5-6.0 wt. %.
A process for manufacturing a sugar reduced wafer comprising the steps of
- providing a composition comprising 60-80 wt. % of flour, 10-23 wt. % of sucrose, 0.5-8.0 wt. % of oil or fat, 5-20 wt. % of non-digestible fibers, and wherein the total amount of mono and disaccharides is 10-25 wt. %, all wt. % being in weight percentage of the composition dry mass;
- adding the composition in onto baking plates or iron;
- baking the mixture in an oven at a temperature between 180° C. and 215° C. for 50 to 75 sec;
- and
- shaping the baked wafer thus obtained, before they become rigid.
(canceled)
Dependencies are inferred from the claim text.