Semiconductor device having plate-shaped metal terminals facing one another

A semiconductor device comprising:

• a substrate;
• a first metal layer on the substrate;
• a second metal layer on the substrate;
• a first semiconductor chip on the first metal layer and having a first upper electrode, a first lower electrode, and a first gate electrode;
• a second semiconductor chip on the second metal layer and having a second upper electrode, a second lower electrode, and a second gate electrode;
• a plate-shaped first metal terminal electrically connected to the first upper electrode;
• a plate-shaped second metal terminal facing the first metal terminal and electrically connected to the second lower electrode;
• a third metal terminal electrically connected to the first lower electrode and the second upper electrode;
• a first gate terminal electrically connected to the first gate electrode;
• a second gate terminal electrically connected to the second gate electrode;
• and
• a resin layer between the first metal terminal and the second metal terminal,
• wherein a first distance between the first metal terminal and the second metal terminal at an end portion of the first metal terminal on a side opposite to a side electrically connected to the first semiconductor chip is larger than a second distance between the first metal terminal and the second metal terminal at a portion located in a direction from the end portion of the first metal terminal toward the first semiconductor chip.