Semiconductor device

A semiconductor device comprising:

• a base member;
• and
• a plurality of memory chips stacked on the base member and electrically connected to each other through connection members, the plurality of memory chips including a first memory chip and a second memory chip adjacent to the first memory chip,
• the first memory chip including a semiconductor substrate having an element surface and a back surface opposite to the element surface, a memory cell array provided on the element surface and including a plurality of memory cells, terminal parts electrically connected to the memory cell array, and a plurality of through electrodes extending from the back surface to the element surface in the semiconductor substrate and connected to the terminal parts,
• the second memory chip being electrically connected to the first memory chip through the connection members connected to the plurality of through electrodes,
• the terminal parts including a first terminal part and a second terminal part, the first terminal part including a first contact pad, the second terminal part including a second contact pad positioned at a level between the semiconductor substrate and the first contact pad in a stacking direction of the plurality of memory chips, and
• the plurality of through electrodes including a first through electrode connected to the first contact pad in the first terminal part, and a second through electrode connected to the second contact pad in the second terminal part.