Back to results
US 2019/0295968 A1Published application
Semiconductor packages
AssigneeAnalog Devices Global Unlimited Company
InventorsBilge Bayrakci, Abdullah Celik, Winslow Round, Santosh Anil Kudtarkar, Yusuf Atesal, Turusan Kolcuoglu
Life of this patent
Estimating the term…
Abstract
A package is disclosed. The package includes a carrier that comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side. The first conductive layer comprises wire bonding pads. The package also includes a semiconductor die that is flip chip mounted on the first side of the carrier.
Claims20
A package comprising:
- a carrier comprising a first conductive layer on a first side and a second conductive layer on a second side opposite the first side, wherein the first conductive layer comprises wire bonding pads;
- a semiconductor die flip chip mounted on the first side of the carrier.
An apparatus comprising:
- a printed circuit board (PCB) comprising a first conductive layer and a second conductive layer separated by dielectric, wherein the first conductive layer is on a first side of the PCB, and wherein the PCB includes a recess on the first side and extending through the first conductive layer and the dielectric to the second conductive layer;
- a carrier including a first conductive layer on a first side and a second conductive layer on a second side, wherein the carrier is positioned in the recess of the PCB, and wherein the second conductive layer of the carrier is electrically connected to the second conductive layer of the PCB in the recess;
- and
- a semiconductor die attached flip-chip to the first side of the carrier and configured to receive electrical ground from the second conductive layer of the PCB by way of the carrier.
1 more element
A package comprising:
- means for carrying a semiconductor die by way of flip chip mounting,
- wherein the carrying means comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side, wherein the first conductive layer comprises wire bonding pads
Dependencies are inferred from the claim text.