Enabling magnetic films in inductors integrated into semiconductor packages

A method of forming a cored or coreless semiconductor package, comprising:

• forming a plurality of inductor features on a first build-up layer, the plurality of inductor features comprising a pad and a conductive line;
• forming a raised pad structure on the first build-up layer by fabricating a pillar structure on the pad, wherein a size of the pillar structure is approximately equal or equal to a corresponding size of the pad such that the pillar structure and the pad are aligned or minimally misaligned relative to each other;
• encapsulating the plurality of inductor features and the raised pad structure in a magnetic film, the magnetic film comprising one or more magnetic fillers;
• planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar;
• depositing an additional layer on the top surfaces of the raised pad structure and the magnetic film;
• and
• forming a via on the top surface of the raised pad structure by removing one or more portions of the additional layer above the raised pad structure.

A semiconductor package, comprising:

• a plurality of inductor features on a first build-up layer, the plurality of inductor features comprising a pad and a conductive line;
• a raised pad structure on the first build-up layer, the raised pad structure comprising a pillar structure on the pad, wherein a size of the pillar structure is less than a corresponding size of the pad;
• a magnetic film encapsulating the plurality of inductor features and the raised pad structure in a magnetic film, the magnetic film comprising one or more magnetic fillers, wherein top surfaces of the raised pad structure and the magnetic film are co-planar;
• an additional layer on the top surfaces of the raised pad structure and the magnetic film;
• and
• a via on the top surface of the raised pad structure, the via being formed through the additional layer.