Integrated circuit package with test circuitry for testing a channel between dies

A computer device, comprising:

• a printed circuit board (PCB);
• and
• an integrated circuit (IC) package coupled to the PCB, the IC package comprising:
• a first die;
• a second die;
• and
• a channel that couples the first die to the second die, wherein the first die includes:
• a transmitter;
• test circuitry coupled between the transmitter and the channel, wherein the test circuitry is to control charge and discharge of the channel;
• and
• a receiver coupled to the channel, wherein the receiver is to:
• determine a voltage of the channel during charge and discharge of the channel;
• and
• output an indication of the voltage.

A method of testing a channel of an integrated circuit (IC) package, comprising:

• applying, by a computer device, a test pattern to test circuitry of a die of the IC package, wherein the test circuitry is coupled to the channel and controls charging and discharging of the channel;
• generating, by the computer device, a voltage versus time representation for the channel based on a voltage of the channel produced by the test pattern being applied;
• and
• determining, by the computer device, functionality of the channel based on the voltage versus time representation.