Semiconductor package and method for manufacturing the same

A semiconductor package, comprising:

• a substrate having a first surface and a second surface opposite to the first surface, defining an opening, and comprising a conductive post disposed in the opening;
• a microelectromechanical device disposed on the substrate;
• an interconnection structure disposed between the substrate and the microelectromechanical device;
• a sealing structure disposed between the substrate and the microelectromechanical device;
• a first conductive pattern disposed on the first surface of the substrate and facing toward the microelectromechanical device;
• and
• a second conductive pattern disposed on the second surface of the substrate,
• wherein the first conductive pattern is electrically connected to the second conductive pattern through the conductive post, and
• the interconnection structure is surrounded by the sealing structure.

A method for manufacturing a semiconductor package, comprising:

• providing a substrate;
• providing a microelectromechanical device;
• and
• forming an interconnection structure and a sealing structure between the substrate and the microelectromechanical device.