Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsKumiko Karouji, Morihiko Ikemizu, Yoshihisa Imori, Hiroaki Kishi, Tomohiko Imada, Akito Shimizu
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Abstract
According to one embodiment, a semiconductor device includes a first semiconductor chip, a heat dissipation member provided on one surface of the first semiconductor chip and connected to the first semiconductor chip, and a sealing resin sealing the first semiconductor chip and the heat dissipation member. The heat dissipation member includes mutually interlaced metal fibers and a thermosetting resin.
Claims20
A semiconductor device, comprising:
- a first semiconductor chip;
- a heat dissipation member provided on one surface of the first semiconductor chip and connected to the first semiconductor chip;
- and
- a sealing resin sealing the first semiconductor chip and the heat dissipation member,
- the heat dissipation member including mutually interlaced metal fibers and a thermosetting resin.
A semiconductor device, comprising:
- a semiconductor chip;
- a die pad placing the semiconductor chip;
- and
- a connection terminal electrically connected to the semiconductor chip,
- at least a portion of the die pad and the connection terminal including a metal fiber layer including mutually interlaced metal fibers and a thermosetting resin.
A semiconductor device, comprising:
- a semiconductor chip;
- an interconnection member electrically connecting the semiconductor chip and an external circuit;
- and
- a sealing resin sealing at least a portion of the semiconductor chip, the connection terminal, or the interconnection member,
- the interconnection member including mutually interlaced metal fibers and a thermosetting resin.
Dependencies are inferred from the claim text.