Chip Package Structure, Terminal Device, and Method

A terminal device, comprising a chip package structure, the chip package structure comprising:

• a substrate;
• a chip disposed on the substrate;
• a plurality of solder balls, the chip being coupled with the substrate through the plurality of solder balls, the plurality of solder balls being disposed between the substrate and the chip in array, a distance between neighbor rows of the solder balls in array gradually increasing along a direction toward a center of the chip package structure, and a distance between neighbor columns of the solder balls in array gradually increasing along the direction toward the center of the chip package structure;
• a filling layer disposed on the substrate, the filling layer surrounding and encapsulating a side of the chip away from the substrate and a sidewall of the chip, and being made of epoxy molding compound, the epoxy molding compound being white;
• and
• a reinforcement member disposed on the substrate, the reinforcement member surrounding an outside of the filling layer, being located adjacent to the filling layer, and extending beyond an edge of the substrate.

A method for manufacturing a chip package structure, comprising:

• providing a substrate;
• disposing a chip on the substrate;
• and
• disposing a plurality of solder balls in array between the substrate and the chip, a distance between neighbor rows of the plurality of solder balls in array gradually increasing along a direction toward a center of the chip package structure, and a distance between neighbor columns of the plurality of solder balls in array gradually increasing along the direction toward the center of the chip package structure;
• disposing a filling layer on the substrate, the filling layer surrounding and encapsulating a side of the chip away from the substrate and a sidewall of the chip, and being made of epoxy molding compound, the epoxy molding compound being white;
• and
• disposing a reinforcement member on the substrate, the reinforcement member surrounding an outside of the filling layer, being located adjacent to the filling layer, and extending beyond an edge of the substrate.