Package, package-on-package structure, and method of manufacturing package-on-package structure

A package-on-package (PoP) structure, comprising:

• a first package, comprising:
• a die, having an active surface and a rear surface opposite to the active surface;
• a plurality of conductive structures surrounding the die, wherein the plurality of conductive structures comprises elliptical columns;
• an encapsulant encapsulating the die and the plurality of conductive structures;
• a redistribution structure over the active surface of the die, the plurality of conductive structures, and the encapsulant;
• a dielectric layer over the encapsulant and the rear surface of the die, wherein the dielectric layer exposes the plurality of conductive structures;
• and
• a plurality of joint terminals disposed on the plurality of conductive structures, wherein the plurality of joint terminals comprises ellipsoids;
• and
• a second package on the first package, wherein the second package is electrically connected to the first package through the plurality of joint terminals.

A method of manufacturing a package-on-package (PoP) structure, comprising:

• forming a first package, comprising:
• providing a carrier having a dielectric layer formed thereon;
• forming a die and a plurality of conductive structures on the dielectric layer, wherein the die has an active surface and a rear surface opposite to the active surface, the dielectric layer is over the rear surface of the die, the plurality of conductive structures surround the die, and the plurality of conductive structures comprises elliptical columns;
• encapsulating the die and the plurality of conductive structures by an encapsulant, wherein the dielectric layer is over the encapsulant;
• forming a redistribution structure on the active surface of the die, the plurality of conductive structures, and the encapsulant;
• separating the carrier form the dielectric layer;
• forming a plurality of elliptical openings in the dielectric layer to expose the plurality of conductive structures;
• and
• forming a plurality of joint terminals in the plurality of elliptical openings of the dielectric layer, wherein the plurality of joint terminals is disposed on the plurality of conductive structures and comprises ellipsoids;
• and
• stacking a second package on the first package, wherein the second package is electrically connected to the first package through the plurality of joint terminals.