Method of separating electronic devices having a back layer and apparatus

A method of singulating a wafer comprising:

• providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces, wherein the wafer has first and second opposing major surfaces, and wherein a layer of material is formed atop the second major surface, and wherein portions of the layer of material are adapted to remain atop surfaces of the plurality of die after completion of the method of singulating the wafer;
• placing the wafer onto a carrier substrate;
• singulating the wafer through the spaces to form singulation lines, wherein singulating comprises leaving at least a portion of the layer of material over the singulation lines;
• and
• placing the wafer and the carrier substrate adjacent a support structure;
• providing a compression structure having a lateral width greater than that of the wafer;
• and
• separating the layer of material over the singulation lines by:
• applying a pressure to the wafer by using the compression structure;
• and
• applying mechanical vibrations to fatigue the layer of material during at least a portion of the step of applying the pressure.

A method of singulating a wafer comprising:

• providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces, wherein the wafer has first and second opposing major surfaces, and wherein a layer of material is formed atop the second major surface, and wherein portions of the layer of material are adapted to remain atop surfaces of the plurality of die after completion of the method of singulating the wafer;
• placing the wafer onto a carrier substrate;
• singulating the wafer through the spaces to form singulation lines, wherein singulating comprises leaving at least a portion of the layer of material under the singulation lines;
• and
• separating the layer of material under the singulation lines by:
• applying pressure to the wafer;
• and
• applying high frequency vibrations to fatigue the layer of material.