Back to results
US 2019/0295880 A1Published application
Chemical vapor deposition wafer carrier with thermal cover
OwnerSandeep Krishnan, Yuliy Rashkovsky +3inventors
InventorsSandeep Krishnan, Yuliy Rashkovsky, Alexander Gurary, Leo Chin, Mandar Deshpande
Life of this patent
Estimating the term…
Abstract
A wafer carrier as described and claimed herein includes a thermal cover and a plurality of platforms with corresponding radially inner and outer pedestals.
Claims17
A wafer carrier configured to be used with a chemical vapor deposition device, the wafer carrier comprising:
- a plate having a top surface and a bottom surface arranged opposite one another;
- a plurality of platforms defined on the top surface of the plate;
- one or more cover segments configured to engage with the top surface of the plate, each of the one or more cover segments defining at least one aperture corresponding to one of the plurality of platforms;
- the improvement comprising:
- for each platform and a corresponding cover segment:
- a plurality of radially inner pedestals arranged on only the platform to support a corresponding substrate, and
- a plurality of radially outer pedestals arranged on only the top surface and configured to support the corresponding cover segment.
4 more elements
The wafer carrier of claim 11, wherein the locking feature is arranged at the geometric center of the bottom surface.
The wafer carrier of claim 12, wherein the locking feature is selected from the group consisting of a spline, a chuck, or a keyed fitting.
Dependencies are inferred from the claim text.