Substrate cleaning method, substrate cleaning apparatus, and method for fabricating a semiconductor device using the apparatus

A method for fabricating a semiconductor device, comprising:

• etching a substrate to form trenches;
• cleaning the substrate in a wet process to remove first particles produced in the trenches;
• providing a supercritical fluid onto the substrate to remove moisture the substrate;
• and
• cleaning the substrate in a dry process to remove second particles produced on a top surface of the substrate by the supercritical fluid that are different from the first particles.

An apparatus for cleaning a substrate comprising:

• an index module configured to load or unload a substrate in or from a carrier;
• a cleaning module configured to perform a cleaning process on the substrate;
• a dehumidification module configured to remove moisture from the substrate using a supercritical fluid;
• and
• a transfer module disposed near the dehumidification module, the cleaning module, and the index module, wherein the transfer module is configured to transfer the substrate from one of the index module, the cleaning module, and the dehumidification module to another,
• wherein the transfer module comprises:
• a transfer unit disposed between the cleaning module and the index module, wherein the transfer unit is configured to transfer the substrate from one of the cleaning module and the dehumidification module to the other;
• and
• a buffer unit disposed between the transfer unit and the index module, wherein the buffer unit comprises an annealing portion configured to heat the substrate and to remove defect particles produced on the substrate by the supercritical fluid.