Temperature measurement for substrate carrier using a heater element array
AssigneeApplied Materials, Inc.
InventorsPhillip Criminale, Zhiqiang Guo
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AssigneeApplied Materials, Inc.
InventorsPhillip Criminale, Zhiqiang Guo
Estimating the term…
Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.
A method to determine a temperature profile of a substrate attached to a carrier during processing, the method comprising:
A machine-readable medium having instructions thereon that when operated on by the machine cause the machine to perform operations comprising:
Dependencies are inferred from the claim text.