Colocating signal processing device with micromechanical scanning silicon mirror

An apparatus, comprising:

• a micromechanical scanning silicon mirror, comprising:
• a mirror section;
• a first foot and a second foot;
• a first flexure and a second flexure, the first flexure between the mirror section and the first foot, a distal end of the first flexure terminates at the first foot, the second flexure between the mirror section and the second foot, and a distal end of the second flexure terminates at the second foot;
• a piezoresistive sensor;
• and
• sensor contacts, the sensor contacts electrically coupled to the piezoresistive sensor;
• and
• a signal processing device, the signal processing device mounted on the first foot of the micromechanical scanning silicon mirror, and the signal processing device being electrically coupled to the sensor contacts;
• wherein the micromechanical scanning silicon mirror and the signal processing device are part of separate dies.

A method of constructing an apparatus, comprising:

• providing a frame, the frame configured to tilt relative to a printed circuit board;
• mounting a micromechanical scanning silicon mirror on the frame;
• and
• mounting a signal processing device on the micromechanical scanning silicon mirror, wherein the micromechanical scanning silicon mirror and the signal processing device are part of separate dies.