Chemical mechanical polishing composition and method of manufacturing circuit board

Abstract

Provided is a chemical mechanical polishing composition to be used for forming a circuit board including a resin substrate on which a wiring layer containing copper or a copper alloy is provided, the chemical mechanical polishing composition including: (A) at least one selected from a group consisting of carboxyl group-containing organic acids and salts thereof; (B) a basic compound having a first acid dissociation constant (pKa) of 9 or more; and (C) abrasive grains, wherein the component (A) has a complex stability constant with copper of 5 or less, and wherein the chemical mechanical polishing composition has a pH value of from 1 to 3.

Dependencies are inferred from the claim text.