Conductive coating material and production method for shielded package using conductive coating material

A conductive coating material comprising, at least:

• (A) 100 parts by mass of binder component containing 5 to 30 parts by mass of solid epoxy resin which is a solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin which is a liquid at normal temperature in a range not exceeding 100 parts by mass in total;
• (B) 500 to 1800 parts by mass of metal particles;
• and
• (C) 0.3 to 40 parts by mass of hardener,
• wherein the metal particles include (a) spherical metal particles and (b) flaky metal particles, and a mass ratio of (a) the spherical metal particles to (b) the flaky metal particles is 25:75 to 75:25 (in terms of (a):(b)), and
• wherein a viscosity at a liquid temperature of 25° C. of the conductive coating material is 100 to 600 mPa·s when measured at rotation speed of 0.5 rpm with a cone-plate rotary viscometer.