Component mounter

A component mounter comprising:

• a head provided with multiple component holding sections;
• a head moving device configured to move the head;
• a component supply device configured to supply components provided with a connection terminal on a lower side of the component to the component holding section;
• an imaging device configured to image the component held by the component holding tool;
• a transfer device configured to provide a coating layer of a paste that is to be transferred to the connection terminal of the component;
• and
• a control device configured to control the head, the head moving device, the component supply device, the imaging device, and the transfer device based on a first operation mode, wherein
• in the first operation mode, the control device is configured to perform control to, after the components supplied by the component supply device have been sequentially picked up by the multiple component holding sections of the head, cause the imaging device to image the components held by the multiple component holding sections, recognize the position and/or orientation of each of the components based on the images of each component, and control the head and the head moving device based on the position and/or orientation of each of the components such that the coating layer is transferred to the connection terminals of each of the components in a transfer area of each of the components set in advance that does not include a margin based on the holding deviation of each of the components, and then each of the components is mounted on the board.