Cooling methods for electronic components
AssigneeInternational Business Machines Corporation
InventorsAaron R. Cox, William J. Grady, IV, Jason A. Matteson, Jason E. Minyard
Life of this patent
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Abstract
A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.
Claims15
A method for conveying heat away from an electronic component, the method comprising:
- installing a connector of the electronic component into a receptacle;
- and
- fitting a conformable thermal interface sleeve over the electronic component by inserting the electronic component through an opening to an interior portion of the conformable thermal interface sleeve such that the interior portion embraces both a first side surface of the electronic component and a second side surface of the electronic component,
- wherein, after the conformable thermal interface sleeve is fitted over the electronic component and the electronic component is installed, heat generated by the electronic component during use is conducted away from the electronic component through the conformable thermal interface sleeve.
A method for removing heat generated by an electronic component, wherein a conformable thermal interface sleeve is fitted over the electronic component such that an interior portion of the conformable thermal interface sleeve embraces both a first side surface of the electronic component and a second side surface of the electronic component, the method comprising:
- conducting the heat generated by the electronic component, over which the conformable thermal interface sleeve is fitted, away from the electronic component through the conformable thermal interface sleeve.
Dependencies are inferred from the claim text.