US 2019/0246505 A1 · SEMICONDUCTOR PACKAGE MODULE

Abstract

A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.

Claims20

Dependent claims

A semiconductor package module comprising:

a module substrate;
at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT);
a plurality of passive devices mounted on the module substrate;
and
at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.

2 more elements

A semiconductor package array structure comprising:

a module substrate array including at least two module substrates coupled to each other;
at least one first part mounted on each of the at least two module substrates by using surface mount technology (SMT);
at least one second part mounted on each of the module substrates by using SMT and a resin film adhesive, the at least one second part having a size or a weight greater than a size or a weight of the at least one first part;
and
at least one passive device mounted on at least one of the module substrates,
wherein a top surface and a bottom surface of the at least two module substrates are arranged alternately in a first direction when viewed from a first surface of the module substrate array.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor package module

Life of this patent

Semiconductor package module

Life of this patent

Abstract

Claims20