Electronic component-embedded substrate and electronic component device
AssigneeShinko Electric Industries Co., Ltd.
InventorMichiro Ogawa
Life of this patent
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Abstract
An electronic component-embedded substrate includes a first insulation layer having a quadrangular cavity formed therein, and an electronic component arranged in the cavity. The cavity has two adjacent first inner wall surfaces, protrusions protruding inward from the two first inner wall surfaces, respectively, and two adjacent inclined second inner wall surfaces arranged at opposite sides to the two first inner wall surfaces and inclined downward from an outer side toward an inner side. The electronic component is in contact with the protrusions of the cavity.
Claims7
An electronic component-embedded substrate comprising:
- a first insulation layer having a quadrangular cavity formed therein;
- and
- an electronic component arranged in the cavity,
- wherein the cavity has:
- two adjacent first inner wall surfaces,
- protrusions protruding inward from the two first inner wall surfaces, respectively, and
- at least one second inner wall surface arranged at an opposite side to one of the two first inner wall surfaces and inclined downward from an outer side toward an inner side, and
- wherein the electronic component is in contact with the protrusions of the cavity.
An electronic component device comprising:
- an electronic component-embedded substrate including
- a first insulation layer having a quadrangular cavity formed therein;
- a first electronic component arranged in the cavity;
- a wiring layer arranged in a lateral region of the first electronic component and covered with the first insulation layer;
- a second insulation layer formed on the first insulation layer and the first electronic component;
- a first via hole formed in the second insulation layer and reaching a connection terminal of the first electronic component,
- a second via hole formed in the second insulation layer and the first insulation layer and reaching the wiring layer,
- a first pad formed on the second insulation layer and connected to the connection terminal of the first electronic component through the first via hole, and
- a second pad formed on the second insulation layer and connected to the wiring layer through the second via hole;
- and
- a second electronic component connected to the first pad and the second pad of the electronic component-embedded substrate,
- wherein the cavity has:
- two adjacent first inner wall surfaces,
- protrusions protruding inward from the two first inner wall surfaces, respectively, and
- at least one second inner wall surface arranged at an opposite side to one of the two first inner wall surfaces and inclined downward from an outer side toward an inner side, and
- wherein the first electronic component is in contact with the protrusions of the cavity.
Dependencies are inferred from the claim text.