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US 2019/0246501 A1Published application
Metallic Layer as Carrier For Component Embedded in Cavity of Component Carrier
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsMike Morianz, Christian Galler, Gerhard Stubenberger
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Abstract
A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.
Claims17
A method of manufacturing a component carrier, comprising:
- providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer;
- removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer;
- inserting a component in the cavity;
- and
- placing the component on the metallic layer.
2 more elements
A component carrier, comprising:
- a base structure having a front side, a back side, and a cavity extending from the front side to the back side;
- a metallic layer on the back side of the base structure;
- and
- a component in the cavity, wherein a lower main surface of the component is at the same vertical level as an upper main surface of the metallic layer.
1 more element
Dependencies are inferred from the claim text.