US 2019/0246499 A1 · Vertical-Side Solder Method and Package for Power GaN Devices

Abstract

A packaged GaN semiconductor device with improved heat dissipation is provided. A GaN device is packaged on a printed circuit board (PCB) with a vertical side of the device, and optionally the back side of the device, in thermal contact with the PCB. The packaging is compatible with surface mount technologies such as land grid array (LGA), ball grid array (BGA), and other formats. Thermal contact between the PCB and a vertical side of the device, and optionally the back side of the device, is made through solder. The solder used for the thermal contact may also connect a source terminal of the device, which also improves electrical stability of the device. The packaging is particularly suitable for GaN HEMT devices.

Claims16

Dependent claims

A semiconductor device packaged on a printed circuit board (PCB), comprising:

metal contact pads disposed on a bottom side of the semiconductor device, wherein the bottom side of the semiconductor device substantially faces the PCB and the metal contact pads are soldered to respective metal traces of the PCB;
at least one metal trace of the PCB that extends beyond an area of the PCB covered by the semiconductor device;
wherein the at least one metal trace of the PCB is soldered to at least one of a vertical side and a back side of the semiconductor device.

Dependencies are inferred from the claim text.

Facts

Application

16/254,296Filed 22 Jan 2019

Priority

3 Feb 2018

Published

8 Aug 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification19 codes

H05K 1/0209
Cooling of mounted components: external configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
H05K 1/181
Structurally associated with non-printed electric components: associated with surface mounted components
H05K 1/0203
Thermal arrangements, e.g. for cooling, heating or preventing overheating: cooling of mounted components
H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out

Vertical-Side Solder Method and Package for Power GaN Devices

Life of this patent

Vertical-Side Solder Method and Package for Power GaN Devices

Life of this patent

Abstract

Claims16