High-frequency board, high-frequency package, and high-frequency module
AssigneeKYOCERA Corporation
InventorYoshiki KAWAZU
Life of this patent
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Abstract
A high-frequency board includes an insulating substrate, a first line conductor, and a second line conductor. The insulating substrate has an upper surface with a recess. The first line conductor is located on the upper surface of the insulating substrate. The second line conductor is located on the upper surface of the insulating substrate and extends parallel to the first line conductor with a space from the first line conductor as viewed from above. The recess is located between the first line conductor and the second line conductor, and has a lower dielectric constant than the insulating substrate.
Claims8
A high-frequency board, comprising:
- an insulating substrate having an upper surface with a recess;
- a first line conductor located on the upper surface of the insulating substrate;
- and
- a second line conductor located on the upper surface of the insulating substrate and extending parallel to the first line conductor with a space from the first line conductor as viewed from above,
- wherein the recess is located between the first line conductor and the second line conductor, and has a lower dielectric constant than the insulating substrate.
Dependencies are inferred from the claim text.