Back to results
US 2019/0246491 A1Published application
Thermal Management In Circuit Board Assemblies
AssigneeKuprion Inc.
InventorAlfred A. Zinn
Life of this patent
Estimating the term…
Abstract
Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.
Claims20
A method comprising:
- providing a printed circuit board (PCB) defined upon a substrate and having one or more vias extending through the substrate between a first face and a second face;
- filling the one or more vias with a metal nanoparticle paste composition that is adapted to limit shrinkage during metal nanoparticle consolidation;
- consolidating metal nanoparticles of the metal nanoparticle paste composition within the one or more vias to form a monolithic metal body filling each of the one or more vias;
- and
- placing a heat sink upon at least one of the first face or the second face, the heat sink contacting each monolithic metal body.
2 more elements
A printed circuit board (PCB) comprising:
- a substrate having one or more vias extending therethrough between a first face and a second face;
- a monolithic metal body formed from metal nanoparticles filling each of the one or more vias, the monolithic metal body having a uniform nanoporosity ranging from about 2% to about 30%;
- and
- a heat sink upon at least one of the first face or the second face, the heat sink contacting each monolithic metal body.
1 more element
A printed circuit board (PCB) comprising:
- a substrate having one or more vias extending therethrough between a first face and a second face, at least a portion of the one of more vias being about 1 mm or larger in diameter;
- a monolithic metal body formed from metal nanoparticles filling each of the one or more vias;
- wherein at least a portion of the one or more vias contain a reinforcement material that extends through at least a portion of the monolithic metal body;
- and
- a heat sink upon at least one of the first face or the second face, the heat sink contacting each monolithic metal body.
2 more elements
Dependencies are inferred from the claim text.