Circuit board, manufacturing method for circuit board and camera module

A method for forming a circuit board, comprising:

• providing a copper cladding substrate, the copper cladding substrate comprises an insulating layer and a copper layer formed on the insulating layer;
• forming conducting traces at a predetermined location on the insulating layer, the conducting traces define a wiring area, an area locating inside of the wiring area is a heat dissipation area, the wiring area is electrically insulated from the heat dissipation area;
• forming a cover layer on the conducting traces;
• forming at least one blind hole in the heat dissipation area, the at least one blind hole passes through the insulating layer and exposes the copper layer in the heat dissipation area;
• and
• forming a thermally conductive pillar in the at least one blind hole.

A camera module comprising:

• a circuit board;
• an image sensor electrically connected to the circuit board;
• at least one lens holder disposed on the circuit board;
• at least one lens module received in the at least one lens holder;
• wherein the circuit board comprises a heat dissipation area in the central thereof and a wiring area besides the heat dissipation area, the wiring area being electrically insulated from the heat dissipation area, the wiring area comprises a plurality of conducting traces, the heat dissipation area defines a plurality of dissipating holes passing the circuit board, each dissipating hole is provided with a thermally conductive pillar;
• and
• wherein the image sensor is mounted on the heat dissipation area, heat generated by the image sensor is able to dissipate via the thermally conductive pillar.