Distributed Multi-Aperture Camera Array
AssigneeLockheed Martin Corporation
InventorsMark A. Lamkin, Kyle Martin Ringgenberg, Jordan David Lamkin
Life of this patent
Estimating the term…
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AssigneeLockheed Martin Corporation
InventorsMark A. Lamkin, Kyle Martin Ringgenberg, Jordan David Lamkin
Estimating the term…
In one embodiment, an electronic camera assembly includes a circuit board and a plurality of sensor facets. Each sensor facet is coupled to a respective one of a plurality of facet locations on one side of the circuit board. Each sensor facet includes a plurality of sensor pixels. Each sensor facet can capture light at a plurality of capture resolutions. Each sensor facet includes a selectable capture resolution from the plurality of capture resolutions. Each sensor facet is individually addressable such that the plurality of sensor facets are configurable to provide heterogeneous capture resolutions. Each particular facet location is configured to transmit signals from a particular sensor facet that is electrically coupled to the particular facet location to a display, thereby displaying light on the display that corresponds to light captured at a particular selected capture resolution by the particular sensor facet.
An electronic camera assembly comprising:
An electronic camera assembly comprising:
A method of manufacturing an electronic camera assembly, the method comprising:
Dependencies are inferred from the claim text.