Memory device and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorMASAYUKI TERAI
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AssigneeSamsung Electronics Co., Ltd.
InventorMASAYUKI TERAI
Estimating the term…
A memory cell pillar of a memory device includes a heating electrode having a base portion (leg) and a fin portion (ascender), and a selection device between a first conductive line and the heating electrode. A side surface of the selection device and a side surface of the fin portion extend along a first straight line. A method of fabricating a memory device includes forming a plurality of first insulating walls through a stack structure including a preliminary selection device layer and a preliminary electrode layer, forming a plurality of self-aligned preliminary heating electrode layers, forming a plurality of second insulating walls each between two of the plurality of first insulating walls, and forming a plurality of third insulating walls in a plurality of holes extending along a direction intersecting the plurality of first insulating walls.
A memory device comprising:
Dependencies are inferred from the claim text.