Led holder, led module and method for manufacturing led holder

A method for manufacturing a LED holder, comprising:

• forming a plurality of connected lead frames, wherein each of the lead frames comprises a first electrode and a second electrode, the first electrode comprises a first bottom portion and a first wing portion connected with the first bottom portion, the first wing portion extends from the first bottom portion and bends towards a direction away from the first bottom portion, the second electrode comprises a second bottom portion and a second wing portion connected with the second bottom portion, the second wing portion extends from the second bottom portion and bends towards a direction away from the second bottom portion;
• disposing the plurality of connected lead frames in a mold, and forming a plurality of connected insulating carriers on the plurality of connected lead frames in the mold by injection molding, wherein each of the insulating carriers comprises a first sidewall, a second sidewall and a partition portion, the first sidewall is opposite to the second sidewall, the partition portion is positioned between the first sidewall and the second sidewall, the first sidewall has a sloped first inner side surface, the second sidewall has a sloped second inner side surface, the first wing portion is located on the first inner side surface, and the second wing portion is located on the second inner side surface;
• and
• cutting the plurality of connected lead frames and the plurality of connected lead frames along cutting slits, thereby obtaining a plurality of separated LED holders, wherein each of the LED holders comprises one of the lead frames and one of the insulating carriers fixed with the lead frame.

A LED module, comprising an insulating carrier, a lead frame and a LED chip, and the lead frame is fixed with the insulating carrier;

• wherein the insulating carrier comprises a first sidewall, a second sidewall and a partition portion, the first sidewall is opposite to the second sidewall, the partition portion is positioned between the first sidewall and the second sidewall, the first sidewall has a sloped first inner side surface, and the second sidewall has a sloped second inner side surface;
• wherein the lead frame comprises a first electrode and a second electrode, the first electrode and the second electrode are positioned at two opposite sides of the partition portion and are insulated from each other by the partition portion, the first electrode comprises a first bottom portion and a first wing portion connected to the first bottom portion, the first bottom portion is adjacent to the partition portion of the insulating carrier, the first wing portion extends from the first bottom portion and bends towards the first inner side surface and further locates on the first inner side surface;
• the second electrode comprises a second bottom portion and a second wing portion connected to the second bottom portion, the second bottom portion is adjacent to the partition portion of the insulating carrier, the second wing portion extends from the second bottom portion and bends towards the second inner side surface and further locates on the second inner side surface;
• wherein the LED chip is electrically coupled to the first bottom portion and the second bottom portion.