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US 2019/0245117 A1Published application
Light emitting device and light source module having thereof
AssigneeLG Innotek Co., Ltd.
InventorsJae Jin KIM, Do Hwan KIM
Life of this patent
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Abstract
A light emitting device according to an embodiment includes a body having a recess; a light emitting chip disposed in the recess; and a first dampproof layer sealing the light emitting chip and extended from a surface of the light emitting chip to a bottom of the recess, wherein the light emitting chip includes a wavelength range of 100 nm to 280 nm, and the first dampproof layer includes a fluororesin-based material.
Claims23
An ultraviolet light emitting device comprising:
- a body having a recess;
- a light emitting diode chip disposed in the recess, wherein the light emitting diode chip is to emit light having a wavelength in a range of 100 nm to 280 nm, the light emitting diode chip having at least a side surface and a top surface;
- a light transmitting member disposed on the body, the light transmitting member having a bottom surface, the light transmitting member is to transmit the light having the wavelength in the range of 100 nm to 280 nm;
- a resin layer disposed in the recess, wherein the resin layer is to contact side surfaces of the light emitting diode chip;
- wherein the light transmitting member covers the recess of the body,
- wherein the light transmitting member is attached to the body,
- wherein both the resin layer and the light emitting diode chip are spaced apart from the bottom surface of the light transmitting member by an empty space,
- wherein the resin layer includes a portion that is not vertically overlapped with the light emitting diode chip,
- wherein the portion of the resin layer contacts a bottom surface of the recess and extends between the side surface of the light emitting diode chip and an inner side surface of the recess,
- wherein the light transmitting member is spaced apart from the light emitting diode chip by a first vertical distance which is from the bottom surface of the light transmitting member to the top surface of the light emitting diode chip,
- wherein the light transmitting member is spaced apart from the portion of the resin layer by a second vertical distance which is from the bottom surface of the light transmitting member to a top surface of the portion of the resin layer,
- wherein a maximum distance of the second vertical distance is greater than a maximum distance of the first vertical distance.
9 more elements
An ultraviolet light emitting device comprising:
- a body having a recess;
- a light emitting chip disposed in the recess, wherein the light emitting chip is to emit light having a wavelength in a range of 100 nm to 280 nm, the light emitting chip having side surfaces and a top surface;
- a light transmitting member attached to the body, the light transmitting member to cover the recess, and the light transmitting member having a bottom surface;
- a resin disposed in the recess between sides of the body and sides of the light emitting chip;
- and
- an empty space having both a first portion and a second portion between the light transmitting member and the resin, the first portion being an area of the empty space that is vertically overlapped with the light emitting chip, and the second portion being remaining area of the empty space other than the first portion,
- wherein the first portion of the empty space has a first thickness and the second portion of the empty space has a second thickness, and a maximum value of the second thickness is different than a maximum value of the first thickness.
4 more elements
Dependencies are inferred from the claim text.