Semiconductor device
AssigneeUnited Microelectronics Corp.
InventorsShin-Hung Li, Kuan-Chuan Chen, Nien-Chung Li, Wen-Fang Lee, Chih-Chung Wang
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AssigneeUnited Microelectronics Corp.
InventorsShin-Hung Li, Kuan-Chuan Chen, Nien-Chung Li, Wen-Fang Lee, Chih-Chung Wang
Estimating the term…
A semiconductor device includes semiconductor layer having first device region and second device region. A shallow trench isolation (STI) structure is in the semiconductor layer and located at periphery of the first and second device regions. A first and second insulating layers are on the semiconductor layer and respectively located in the first and second device regions. A first gate structure is located on the first insulating layer. A source region and a drain region are in the semiconductor layer and are located at two sides of the first gate structure. A gate doped region is in a surface region of the semiconductor layer in the second device region to serve as a second gate structure. A channel layer is located on the second insulating layer. A source layer and a drain layer are on the STI structure and are located at two sides of the channel layer.
A semiconductor device comprising:
12-20. (canceled)
Dependencies are inferred from the claim text.