Methods and Apparatus for Sensor Module

A device, comprising:

• an image sensor device;
• an interposer having a first surface and a second surface opposite the first surface, the first surface of the interposer being bonded to a first surface of the image sensor device, wherein the interposer comprises one or more conductive vias extending through the interposer;
• a passivation layer over the one or more conductive vias;
• an image signal processor (ISP) bonded to the second surface of the interposer, a first via of the one or more conductive vias electrically coupling the image sensor device to the ISP;
• an underfill disposed between the ISP and the second surface of the interposer, a first surface of the underfill and a first surface of the passivation layer contacting the second surface of the interposer, the first surface of the underfill and the first surface of the passivation layer being level with one another;
• and
• a heat spreader bonded to the ISP opposite the interposer.

A device, comprising:

• a sensor device over a color filter layer;
• an interposer over and bonded to the sensor device, wherein a plurality of conductive vias extend through the interposer;
• an image signal processor (ISP) over and bonded to the interposer, wherein the ISP and the sensor device are electrically coupled through the plurality of conductive vias;
• and
• a printed circuit board over and bonded to the interposer, wherein the ISP is disposed within a cavity of the printed circuit board.