US 2019/0244939 A1 · Chip-on-Board Display Module, Manufacturing Method thereof, Light-Emitting Diode Device and Manufacturing Method thereof

Abstract

A Chip-on-Board (COB) display module is provided, which includes a Printed Circuit Board (PCB) a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage. The COB display module further includes a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer. A manufacturing method for the COB display module is also disclosed.

Claims23

Dependent claims

A Chip-on-Board (COB) display module, comprising a Printed Circuit Board (PCB), a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer, wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage;

wherein the COB display module further comprises a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer.

A manufacturing method for a Chip-on-Board (COB) display module, comprising the following steps:

S1:
mounting and fixing a plurality of Light-Emitting Diode (LED) luminous units on a Printed Circuit Board (PCB);
S2:
by a packaging adhesive, covering the PCB and wrapping the plurality of LED luminous units thereon to form a packaging adhesive layer, and forming a liquid passage in the packaging adhesive layer between every two adjacent LED luminous units;
S3:
covering, by a reflecting material, two sidewalls of the liquid passage to form a reflecting layer;
and
S4:
preparing a mask, the mask being provided with a plurality of mounting holes matched with a number of the plurality of LED luminous units, then mounting the mask on the PCB, and arranging each of the plurality of LED luminous units in each of the plurality of mounting holes to make the mask become a light shielding layer filling the liquid passage;
or, injecting a light shielding material into the liquid passage to form the light shielding layer filling the liquid passage.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application

16/340,150Filed 17 Oct 2017

Priority

CN 201610955146.027 Oct 2016

Published

8 Aug 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10W 90/00
Package configurations
H10H 20/01
Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]: manufacture or treatment
H10H 20/80
Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]: constructional details
H10H 20/841
Coatings, e.g. passivation layers or antireflective coatings: reflective coatings, e.g. dielectric Bragg reflectors

Chip-on-Board Display Module, Manufacturing Method thereof, Light-Emitting Diode Device and Manufacturing Method thereof

Life of this patent

Chip-on-Board Display Module, Manufacturing Method thereof, Light-Emitting Diode Device and Manufacturing Method thereof

Life of this patent

Abstract

Claims23