Semiconductor assemblies using edge stacking and methods of manufacturing the same

A semiconductor package, comprising:

• a first substrate having a first surface;
• a second substrate having an outermost edge and a second surface generally orthogonal to the first surface;
• one or more dies over the first surface, wherein an outermost die of the one or more dies includes a third surface generally orthogonal to the second surface;
• a plurality of wirebonds extending from the second surface of the second substrate to at least one of (a) the first surface of the first substrate, or (b) the third surface of the outermost die;
• and
• further comprising:
• a mold material disposed over the first substrate and at least partially covering the one or more dies and the wirebonds, wherein the mold material includes a fourth surface generally co-planar with the outermost edge of the second substrate.

A semiconductor package, comprising:

• a first substrate having a first surface;
• a second substrate having an outer edge and a second surface generally orthogonal to the first surface;
• one or more dies over the first surface, wherein an outermost die of the one or more dies includes a third surface generally orthogonal to the second surface and separated from the first surface of the first substrate by a first distance;
• a plurality of wirebonds extending from the second surface of the second substrate to at least one of (a) the first surface of the first substrate, or (b) the third surface of the outermost die;
• and
• wherein the outermost edge is separated from the first surface of the first substrate by a second distance greater than or equal to the first distance.

A semiconductor package, comprising:

• a first substrate having a first surface;
• a second substrate having a second surface generally orthogonal to the first surface;
• one or more dies over the first surface, wherein an outermost die of the one or more dies includes a third surface generally orthogonal to the second surface;
• a plurality of wirebonds extending from the second surface of the second substrate to at least one of (a) the first surface of the first substrate, or (b) the third surface of the outermost die;
• a third substrate having a third surface;
• a fourth substrate having a fourth surface;
• and
• a fifth substrate having a fifth surface;
• wherein, the third, fourth and fifth surfaces are each generally orthogonal to the first surface.