Interconnect Structures and Methods of Forming Same

An interconnect structure comprising:

• a contact pad on a surface of a first substrate;
• a post-passivation interconnect (PPI) contacting a surface of the contact pad;
• a first passivation layer on a surface of the PPI;
• a connector on the surface of the PPI, the first passivation layer directly adjoining a lower portion of the connector;
• a molding compound disposed on a surface of the first passivation layer, the molding compound covering a middle portion of the connector and exposing another portion of the connector;
• and
• a bond pad on a surface of a second substrate, the bond pad being bonded to the connector.

An interconnect structure comprising:

• a contact pad on a top surface of a first substrate;
• a first passivation layer on the top surface of the first substrate, the first passivation layer directly adjoining a first portion of a top surface of the contact pad;
• a second passivation layer on the first passivation layer, the second passivation layer directly adjoining a second portion of the top surface of the contact pad;
• a post-passivation interconnect (PPI) contacting a third portion of the top surface of the contact pad and extending along a top surface of the second passivation layer;
• a third passivation layer on a top surface of the PPI;
• a connector on the top surface of the PPI, the third passivation layer directly adjoining a lower portion of the connector;
• a molding compound disposed on a surface of the third passivation layer and having a concave top surface adjoining the connector, the concave top surface of the molding compound having an angle from about 10 degrees to about 60 degrees relative to a plane parallel with a major surface of the first substrate;
• and
• a bond pad on a first surface of a second substrate, the bond pad being bonded to the connector, the bond pad having a second width, the connector having a first width at an adjoining top surface of the molding compound.

An interconnect structure comprising:

• a post-passivation interconnect (PPI) coupled to a first substrate;
• a conductive connector on the PPI;
• and
• a molding compound on a surface of the PPI, the molding compound having a concave top surface adjoining the conductive connector, the concave top surface of the molding compound having a first angle relative to a plane parallel with a major surface of the first substrate, the first angle being greater than about 50 degrees, the first angle being less than or equal to about 60 degrees.