Method for detecting a breach of the integrity of a semiconductor substrate of an integrated circuit from its rear face, and corresponding device

An integrated circuit, comprising:

• a semiconductor substrate protected by a coating and having a rear face and a front face;
• an electrically conductive wafer fixed on the rear face of the semiconductor substrate inside the coating;
• a plurality of contacts mutually electrically coupled together that are distributed over the front face of the semiconductor substrate;
• and
• a circuit configured to detect a breach of integrity of said semiconductor substrate from the rear face by detecting an opening of the coating facing the rear face of the semiconductor substrate, wherein the circuit is configured to:
• detect removal of at least one part of said electrically conductive wafer by making a first measurement of a resistive value of the semiconductor substrate between a number N of said contacts and the electrically conductive wafer.

An integrated circuit, comprising:

• a semiconductor substrate protected by a coating and having a rear face and a front face;
• an electrically conductive wafer fixed on the rear face of the semiconductor substrate inside the coating;
• a plurality of contacts mutually electrically coupled together that are distributed over the front face of the semiconductor substrate;
• and
• a circuit configured to detect a breach of integrity of said semiconductor substrate from the rear face by:
• detecting an opening of the coating facing the rear face of the semiconductor substrate;
• and
• detecting a thinning of the semiconductor substrate from the rear face by making a first measurement of a resistive value of the semiconductor substrate between a number of M of said contacts and the electrically conductive wafer.