Semiconductor device and method of inspecting the same

A method of inspecting a semiconductor device, the method comprising:

• measuring a resistance value between a first terminal and second terminal;
• determining a connection state of a first wire and a second wire to a conductive shield layer based on the resistance value, wherein the semiconductor device comprises:
• a wiring board having a first surface, a second surface, the first wire, and the second wire, the first terminal being on the second surface and the second terminal being on the second surface;
• a semiconductor chip on the first surface;
• a sealing resin layer on the first surface and sealing the semiconductor chip;
• and
• the conductive shield layer covering at least a portion of a side surface of the wiring board and the sealing resin layer, wherein
• the first wire and the second wire are electrically insulated each other on the wiring board, and
• the conductive shield layer is electrically connected to the first wire and the second wire.

A method of inspecting a semiconductor device, comprising:

• electrically connecting a first grounding wire on a first surface of a wiring board to a first ground terminal on a second side of the wiring board;
• electrically connecting a second grounding wire on the first surface of the wiring board to a second ground terminal on the second side of the wiring board;
• measuring a resistance value between the first ground terminal and the second ground terminal of the semiconductor device;
• and
• determining the connection state of the first grounding wire and the second grounding wire to a conductive shield layer based on the measured resistance value, wherein
• the first and second grounding wires are electrically isolated from one another on the wiring board and electrically connected to the conductive shield layer at a side surface of the wiring board.