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US 2019/0244909 A1Published application
Semiconductor packages
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYong-Da CHIU, Shiu-Chih WANG, Shang-Kun HUANG, Ying-Ta CHIU, Shin-Luh TARNG, Chih-Pin HUNG
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Abstract
A semiconductor package includes an electrical connection structure. The electrical connection structure includes: a first conductive layer; a second conductive layer on the first conductive layer; and a conductive cap between the first conductive layer and the second conductive layer, the conductive cap having a hardness greater than a hardness of the first conductive layer.
Claims20
An electrical connection structure, comprising:
- a first conductive layer;
- a second conductive layer;
- and
- a conductive cap between the first conductive layer and the second conductive layer, the conductive cap having a hardness about one and a half times greater than a hardness of the first conductive layer,
- wherein the conductive cap includes copper.
2 more elements
A semiconductor package, comprising:
- a substrate;
- a first conductive layer on the substrate, the first conductive layer including a first plurality of grains;
- a second conductive layer on the first conductive layer, the second conductive layer including a second plurality of grains;
- and
- a cap layer between the first conductive layer and the second conductive layer, the cap layer comprising a third plurality of grains,
- wherein a number of the third plurality of grains contacting the first conductive layer is greater than a number of the first plurality of grains contacting the cap layer,
- the cap layer has a hardness about one and a half times greater than a hardness of the first conductive layer, and
- the cap layer includes copper.
5 more elements
A method of forming an electrical connection structure, comprising:
- providing a first conductive layer;
- forming a conductive cap on the first conductive layer, a hardness of the conductive cap being about one and a half times greater than a hardness of the first conductive layer, wherein the conductive cap includes copper;
- and
- bonding a second conductive layer to the conductive cap.
1 more element
Dependencies are inferred from the claim text.