US 2019/0244907 A1 · SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Abstract

A semiconductor package structure includes a first conductive structure, a second conductive structure, a first semiconductor component, a second semiconductor component and a first encapsulant. The first semiconductor component is disposed on the first conductive structure. The first conductive structure includes a first redistribution layer. The second semiconductor component is disposed on the second conductive structure. The second conductive structure includes a second redistribution layer, and the first conductive structure is electrically connected to the second conductive structure. The first encapsulant covers the first semiconductor component and the first conductive structure. A lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.

Claims20

Dependent claims

A semiconductor package structure, comprising:

a first conductive structure comprising a first redistribution layer;
a first semiconductor component disposed on the first conductive structure;
a second conductive structure comprising a second redistribution layer and electrically connected to the first conductive structure;
a second semiconductor component disposed on the second conductive structure, wherein the second semiconductor component and the first conductive structure are disposed side-by-side;
and
a first encapsulant covering the first semiconductor component and the first conductive structure, wherein a lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor package structure and method for manufacturing the same

Life of this patent

Semiconductor package structure and method for manufacturing the same

Life of this patent

Abstract

Claims20