Semiconductor device and semiconductor device manufacturing method

A semiconductor device manufacturing method, comprising:

• a first preparation of placing a cylindrical electrode including a main portion and a narrow portion continuous with the main portion on a lower mold half, the narrow portion having a smaller width than the main portion, to cause the main portion to contact the lower mold half;
• a second preparation of placing an electrode including a looped portion on the lower mold half to house part of the narrow portion in the looped portion and to cause the narrow portion to protrude from the looped portion upward;
• a mold clamping of clamping an upper mold half and the lower mold half together to compress with the upper mold half a portion of the narrow portion which protrudes from the looped portion upward, thus forming a wide portion spreading over the looped portion;
• and
• a resin injection of injecting resin into a cavity surrounded by the upper mold half and the lower mold half to cause the resin to contact a side surface of the main portion.