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US 2019/0244887 A1Published application
Packaged Semiconductor Devices and Methods of Packaging Thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsien-Wei Chen
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Abstract
Packaging methods for semiconductor devices and methods of packaging thereof are disclosed. In some embodiments, a device includes a packaging apparatus and contact pads disposed on the packaging apparatus. The contact pads are arranged in an array of rows and columns. The contact pads include first contact pads proximate a perimeter region of the packaging apparatus and second contact pads disposed in an interior region of the packaging apparatus. A dam structure that is continuous is disposed around the second contact pads. The contact pads comprise a mounting region for a semiconductor device.
Claims20
A method of packaging a semiconductor device, the method comprising:
- providing a packaging apparatus;
- forming a first plurality of contact pads over the packaging apparatus, the first plurality of contact pads being arranged in an array of rows and columns, the first plurality of contact pads comprising a plurality of first contact pads proximate a perimeter region of the packaging apparatus and a plurality of second contact pads disposed in an interior region of the packaging apparatus;
- forming a first dam structure around the plurality of second contact pads, the first dam structure comprising a continuous ring;
- coupling a first semiconductor device to the first plurality of contact pads using a plurality of connectors, the first semiconductor device comprising a second dam structure on a first surface and a third dam structure on a second surface opposite the first surface, the second dam structure being spaced apart from the first dam structure;
- coupling a second semiconductor device to the second surface of the first semiconductor device, the second semiconductor device comprising a fourth dam structure, the fourth dam structure contacting the third dam structure;
- and
- forming a molding material or underfill material around the plurality of first contact pads, the first dam structure, and the third dam structure.
4 more elements
A method of packaging a semiconductor device, the method comprising:
- forming a packaging apparatus, the forming a packaging apparatus comprising:
- forming a first plurality of contact pads over a substrate;
- and
- forming a first dam structure over the substrate;
- forming a first partially packaged semiconductor device comprising a first die interposed between a first interconnect structure and a second interconnect structure, the forming the first partially packaged semiconductor device comprising:
- forming a second dam structure adjacent to and contacting the first interconnect structure;
- and
- forming a third dam structure adjacent to and contacting the second interconnect structure;
- attaching the first partially packaged semiconductor device to the packaging apparatus, first connectors electrically coupling the first plurality of contact pads to the first interconnect structure, wherein after the attaching the first partially packaged semiconductor device, the first dam structure is spaced apart from the second dam structure;
- attaching a second partially packaged semiconductor device to the first partially packaged semiconductor device, the second partially packaged semiconductor device comprising a third interconnect structure and a fourth dam structure adjacent to and contacting the third interconnect structure, second connectors electrically coupling the second interconnect structure to the third interconnect structure, the third dam structure physically contacting the fourth dam structure;
- and
- forming a first molding material or underfill around lateral edges of the first dam structure, the second dam structure, the third dam structure, the fourth dam structure, and the first partially packaged semiconductor device.
9 more elements
A method of packaging a semiconductor device, the method comprising:
- forming a packaging apparatus, the forming the packaging apparatus comprising:
- forming a first plurality of contact pads over a first substrate;
- and
- forming a first dam structure over the first substrate and interposed between a first set of the first plurality of contact pads and a second set of the first plurality of contact pads;
- forming a first partially packaged semiconductor device, the forming the first partially packaged semiconductor device comprising:
- forming a first interconnect structure adjacent to and contacting an active side of a first die;
- forming a second dam structure adjacent to and contacting the first interconnect structure;
- forming a second interconnect structure adjacent to and contacting a backside of the first die;
- and
- forming a third dam structure over the second interconnect structure;
- attaching the first partially packaged semiconductor device to the packaging apparatus, wherein after the attaching the first partially packaged semiconductor device, a surface of the first dam structure faces without contacting a surface of the second dam structure;
- attaching a second partially packaged semiconductor device to the first partially packaged semiconductor device;
- and
- placing a molding material around the first partially packaged semiconductor device, the third dam structure contacting the molding material, the second dam structure being free of the molding material.
11 more elements
Dependencies are inferred from the claim text.