Electronic device
AssigneeDenso Corporation
InventorsKosuke SUZUKI, Atsushi KASHIWAZAKI, Yuki SANADA, Toshihiro NAKAMURA, Shinya UCHIBORI
Life of this patent
Estimating the term…
Abstract
A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.
Claims5
An electronic device comprising:
- a substrate having one surface and another surface opposite to the one surface, and including a plurality of wiring patterns each having at least a straight portion;
- a solder resist covering the wiring patterns;
- an electronic component electrically connected to a portion of at least one of the wiring patterns on the one surface of the substrate, the portion being exposed from the solder resist;
- and
- a resin mold part disposed on the one surface of the substrate to cover the electronic component and to partly cover the wiring patterns and the solder resist, wherein
- the wiring patterns are disposed such that the straight portions are extended to an area outside of the resin mold part,
- the solder resist includes pattern covering portions covering the straight portions of at least adjacent two of the wiring patterns, and
- the pattern covering portions are separated from each other in the area outside of the resin mold part.
An electronic device comprising:
- a substrate having one surface and another surface opposite to the one surface, and including a plurality of wiring patterns each having at least a straight portion;
- a solder resist covering the wiring patterns;
- an electronic component electrically connected to a portion of at least one of the wiring patterns on the one surface of the substrate, the portion exposing from the solder resist;
- and
- a resin mold part disposed on the one surface of the substrate to cover the electronic component and to partly cover the wiring patterns and the solder resist, wherein
- the wiring patterns are disposed such that the straight portions are extended to an area outside of the resin mold part,
- the solder resist includes pattern covering portions covering the straight portions of the wiring patterns, and a connecting portion connecting between the covering portions,
- an end portion of the connecting portion is protruded to the area outside of the resin mold part, and
- the pattern covering portions and the connecting portion are configured to satisfy a relationship of a>2×b, in which a is a distance between the straight portions adjacent to each other, and b is a protruding amount of the connecting portion protruding from an end portion of the resin mold part.
Dependencies are inferred from the claim text.