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US 2019/0244883 A1Published application
Package with wall-side capacitors
AssigneeIntel Corporation
InventorsJenny Shio Yin Ong, Seok Ling Lim
Life of this patent
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Abstract
An apparatus is provided which comprises: a plurality of organic dielectric layers forming a substrate, a plurality of first conductive contacts on a top surface of the substrate, a plurality of second conductive contacts on a bottom surface of the substrate, a plurality of third conductive contacts on a side wall surface of the substrate, and one or more discrete capacitor(s) coupled with the third conductive contacts on the side wall surface. Other embodiments are also disclosed and claimed.
Claims26
1-25. (canceled)
An apparatus comprising:
- a plurality of dielectric layers forming a substrate;
- a plurality of first conductive contacts on a top surface of the substrate;
- a plurality of second conductive contacts on a bottom surface of the substrate opposite of the top surface;
- a plurality of third conductive contacts on a side wall surface of the substrate perpendicular to the top and bottom surfaces;
- and
- one or more discrete capacitor(s) coupled with the third conductive contacts on the side wall surface.
3 more elements
An apparatus comprising:
- one or more integrated circuit die(s);
- and
- a substrate, wherein the substrate comprises:
- a plurality of dielectric layers;
- a plurality of first conductive contacts on a top surface of the substrate, wherein the first conductive contacts are coupled with the one or more integrated circuit die(s);
- a plurality of second conductive contacts on a bottom surface of the substrate;
- a plurality of third conductive contacts on a side wall surface of the substrate;
- and
- one or more discrete capacitor(s) coupled with the third conductive contacts on the side wall surface.
6 more elements
A system comprising:
- a display subsystem;
- a wireless communication interface;
- and
- an integrated circuit package, the integrated circuit package comprising:
- one or more integrated circuit die(s);
- and
- a substrate coupled with the die(s), wherein the substrate comprises:
- a plurality of dielectric layers built upon a substrate core;
- a plurality of first conductive contacts on a top surface of the substrate, wherein the first conductive contacts are coupled with the one or more integrated circuit die(s);
- a plurality of second conductive contacts on a bottom surface of the substrate;
- a plurality of third conductive contacts on a side wall surface of the substrate;
- and
- one or more discrete capacitor(s) coupled with the third conductive contacts on the side wall surface.
10 more elements
A method comprising:
- forming a substrate, the substrate comprising:
- a plurality of dielectric layers;
- a plurality of first conductive contacts on a top surface of the substrate;
- a plurality of second conductive contacts on a bottom surface of the substrate;
- and
- a plurality of third conductive contacts on a side wall surface of the substrate;
- and
- attaching one or more discrete capacitor(s) to the third conductive contacts on a side wall surface of the substrate.
5 more elements
Dependencies are inferred from the claim text.