Display device and chip-on-film structure thereof
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorJing LUO
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AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorJing LUO
Estimating the term…
A display device and a chip-on-film structure thereof are provided. The chip-on-film structure includes a substrate, multiple first output pads, multiple second output pads, multiple first lead wires, and multiple second lead wires. The substrate has a surface including a bonding zone. The first and output pads are located in the bonding zone. The first lead wires and the first output pads are located on the same surface of the substrate. The first lead wires and the second lead wires are located on two opposite surfaces of the substrate. Each of the first lead wires is connected to one of the first output pads. Each of the second lead wires is connected to one of the second output pads. The second lead wires each have a portion corresponding to the bonding zone and having the terminal sections that are respectively opposite to the first and second output pads.
A chip-on-film structure, comprising a substrate, a plurality of first output pads, a plurality of second output pads, a plurality of first lead wires, and a plurality of second lead wires, the substrate having a surface that comprises a bonding zone, the plurality of first output pads and the plurality of second output pads being located in the bonding zone, the plurality of first lead wires and the plurality of first output pads being located on one common surface of the substrate, the plurality of first lead wires and the plurality of second lead wires being respectively located on two opposite surfaces of the substrate, each of the first lead wires being connected to one of the first output pads, each of the second lead wires being connected to the second output pads, the second lead wires each having a portion that corresponds to the bonding zone and has two terminal sections respectively opposite to the first output pads and the second output pads.
A display device, comprising a display panel and a chip-on-film structure, wherein the chip-on-film structure comprises a substrate, a plurality of first output pads, a plurality of second output pads, a plurality of first lead wires, and a plurality of second lead wires, the substrate having a surface that comprises a bonding zone, the plurality of first output pads and the plurality of second output pads being located in the bonding zone, the plurality of first lead wires and the plurality of first output pads being located on one common surface of the substrate, the plurality of first lead wires and the plurality of second lead wires being respectively located on two opposite surfaces of the substrate, each of the first lead wires being connected to one of the first output pads, each of the second lead wires being connected to the second output pads, the second lead wires each having a portion that corresponds to the bonding zone and has two terminal sections respectively opposite to the first output pads and the second output pads;
Dependencies are inferred from the claim text.