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US 2019/0244877 A1Published application
Bi-directional heatsink dampening force system
AssigneeCisco Technology, Inc.
InventorsPhil Slight, Vic Chia
Life of this patent
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Abstract
A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.
Claims20
A circuit board comprising:
- a heatsink coupled to the circuit board via a first coupling mechanism and a second coupling mechanism,
- wherein,
- the first coupling mechanism provides a first force from the heatsink and to the circuit board,
- the second coupling mechanism is positioned adjacent to the first coupling mechanism along the heatsink,
- the second coupling mechanism provides a second force from the circuit board to the heatsink, and
- the second coupling mechanism includes a resilient element positioned between the heatsink and the circuit board.
3 more elements
A circuit board comprising:
- an integrated circuit (IC);
- a heatsink coupled to the IC;
- and
- a first coupling mechanism secured between the heatsink and the circuit board, the first coupling mechanism providing a first force from the heatsink and to the circuit board;
- a second coupling mechanism resiliently secured between the heatsink and the circuit board, the second coupling mechanism providing a second force from the circuit board and to the heatsink.
2 more elements
Dependencies are inferred from the claim text.