Semiconductor apparatus

Abstract

A semiconductor apparatus includes a heat release member, a first substrate that is fixed to the heat release member and on which a semiconductor device is mounted, a second substrate that is spaced from the first substrate in a thickness direction of the first substrate and on which an electronic component is mounted, and a bracket that fixes the second substrate to the heat release member. An electrically non-conductive heat transfer member is disposed between the second substrate and the bracket for transferring heat from the second substrate to the bracket. The bracket is made of a metal. The bracket includes a heat transfer portion that transfers heat to the heat release member.

Dependencies are inferred from the claim text.