Layered cooling structure including insulative layer and multiple metallization layers

An assembly comprising:

• at least one heat emitting device;
• and
• a continuous conformal cooling structure adhering directly to and conforming to surfaces of at least a portion of the at least one heat emitting device, the cooling structure including:
• a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering all such surfaces;
• an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer;
• and
• an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces, wherein the outer metallization layer is exposed directly to an environment exterior of the assembly,
• wherein at least one intersection is formed between a first exterior surface of the insulative layer and a second exterior surface of the insulative layer, and wherein the inner metallization layer conformally covers the at least one intersection and portions of the first and second exterior surfaces of the insulative layer adjacent the at least one intersection.

An assembly comprising:

• at least one heat emitting device;
• and
• a continuous conformal cooling structure adhering directly to and conforming to surfaces of at least a portion of the at least one heat emitting device, the cooling structure including:
• a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering all such surfaces;
• an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer;
• and
• an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces, wherein the outer metallization layer is exposed directly to an environment exterior of the assembly, and
• wherein the inner metallization layer is applied along surfaces of the insulative layer opposite the at least one heat emitting device and opposite an element with which the at least one heat emitting device is in physical contact, adjacent a location where the surfaces of the at least one heat emitting device and the element approach closest to each other.

An assembly comprising:

• at least one heat emitting device;
• and
• a continuous conformal cooling structure adhering directly to and conforming to surfaces of at least a portion of the at least one heat emitting device, the cooling structure including:
• a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering all such surfaces;
• an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer;
• and
• an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces, wherein the outer metallization layer is exposed directly to an environment exterior of the assembly,
• wherein the assembly further comprises at least one fin extending from the outer metallization layer, so as to facilitate heat transfer from the outer metallization layer to the at least one fin.

An assembly comprising:

• at least one heat emitting device physically attached to a substrate, at least a portion of the at least one heat emitting device being positioned along a first side of the substrate;
• a continuous conformal cooling structure including:
• a thermally-conductive, electrically-insulative layer extending from the first side of the substrate to completely cover the at least a portion of the heat emitting device positioned along the first side of the substrate, the insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering the at least a portion of the at least one heat emitting device;
• and
• an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer directly opposite a location where the at least one heat emitting device is physically attached to the substrate;
• and
• an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces.