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US 2019/0244853 A1Published application
Wafer Composite and Method for Producing a Semiconductor Component
AssigneeInfineon Technologies AG
InventorsRudolf Berger, Wolfgang Lehnert, Gerhard Metzger-Brueckl, Guenther Ruhl, Roland Rupp
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Abstract
A wafer composite is provided which includes an auxiliary substrate, a donor substrate and a sacrificial layer formed between the auxiliary substrate and the donor substrate. Functional elements of the semiconductor component are formed in a component layer, including at least one partial layer of the donor substrate. The auxiliary substrate is then separated from the component layer by heat input into the sacrificial layer.
Claims27
A method for producing a semiconductor component, comprising:
- providing a wafer composite comprising an auxiliary substrate, a donor substrate and a sacrificial layer formed between the donor substrate and the auxiliary substrate;
- forming functional elements of the semiconductor component in a component layer, comprising at least one partial layer of the donor substrate;
- and
- separating the auxiliary substrate from the component layer by heat input into the sacrificial layer.
1 more element
A wafer composite, comprising:
- a donor substrate;
- an auxiliary substrate;
- and
- a sacrificial layer formed between the auxiliary substrate and the donor substrate, the sacrificial layer being thermally stable and solid up to at least 1200° C.
1 more element
Dependencies are inferred from the claim text.